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June 17, 2026

Job Title: Sr. Director, Factory Automation
Location: Tempe, Arizona 

What you will be doing:

  • Automation Strategy & Roadmap
    • Define and execute the factory automation strategy aligned with business objectives and industry best practices.
    • Develop a multi-year roadmap for automation across bump, probe, assembly, and test operations.
  • Hardware & Software Ownership
    • Lead the design, deployment, and maintenance of automation hardware (robots, conveyors, material handling systems) and software (MES, equipment integration, data analytics).
    • Ensure seamless integration of automation systems with existing manufacturing equipment and IT infrastructure.
  • Operational Excellence
    • Drive continuous improvement initiatives to enhance throughput, yield, and cycle time through automation.
    • Implement predictive maintenance and real-time monitoring solutions to minimize downtime.
  • Cross-Functional Collaboration
    • Partner with engineering, IT, and operations teams to deliver end-to-end automation solutions.
    • Work closely with equipment suppliers and technology partners to evaluate and adopt cutting-edge automation technologies.
  • Compliance & Standards
    • Ensure all automation systems comply with industry standards, safety regulations, and cybersecurity requirements.
    • Establish and enforce best practices for system reliability, scalability, and data integrity.
  • Leadership & Team Development
    • Build and lead a high-performing automation team, fostering a culture of innovation and accountability.
    • Provide mentorship and training to develop internal automation capabilities.

What you must have:

  • Education: Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Computer Science, or related field.
  • Experience:
    • 13+ years in semiconductor manufacturing automation (OSAT or semiconductor backend operations), with at least 5 years in a leadership role.
    • Proven track record in implementing automation solutions for bump, probe, assembly, and test operations.
    • Familiarity with advanced packaging technologies and Industry 4.0 principles.
    • Knowledge of cloud-based automation platforms and digital twin technologies.
  • Technical Skills:
    • Expertise in MES systems, equipment integration (SECS/GEM, EDA), robotics, PLC programming, and industrial IoT.
    • Strong understanding of data analytics, AI/ML applications in manufacturing, and cybersecurity for OT environments.
Experience
14 - 30 years
Work Level
C-suite
Employment Type
On-Site
Salary
USD 200,000 - 220,000
Valid Until
July 17, 2026
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